Breakthrough in Thermal Management
Technology
The Company has developed and patented a novel electro-chemical process for forming nanoceramic dielectric layers directly onto an aluminium base or arbitrary shape. This technology is already proven and deployed in mass production in applications as diverse as sports, textile and packaging.
After further analysis of the properties of our nanoceramic coating we found that it was ideal for highly efficient substrates, boards, heat sinks which can increase the life of LED lighting and other systems.
Nanoceramic Aluminium Substrates are ideal for applications requiring very low thermal resistance to manage heat generated by HB LEDs. Combination of record high thermal conductivity and low thickness of nanoceramic dielectric layer enables you to solve challenging thermal management problems.
The Analysis Results
X-ray analysis of nanoceramic layers demonstrate that they consist of of sluminium oxide crystals with an average size of around 400A (ie. 40nm).
The compact nano-crystalline structure of the developed ceramic material explains its high thermal conductivity (6-7.2 W/mK) and high dielectric strength (60-110KV/mm) which are significantly above those properties of MC PCBs as well as anodic and Micro Arc Oxide coatings.
The high dielectric strength of nanoceramic materials enables the use of thin layers (10-30um) to provide the required electrical insulation thus reducing the thermal resitance of the substrate.
Comparative Properties
- High Thermal Conductivity and dielectric strength of ceramic layers
- Excellent durability and stability at high temperatures
- Optimal thickness of ceramic layer to fit BDV requirements (no rxcessive thickness)
- Metal tracks are printed directly on ceramic surface
- nanoceramic dielectric layer can be directly applied on any shape Al base such as flat boards, heat sinks, heat pipe and luminary frames
- nanoceramic layer applied on a heat sink enables the most thermally efficient "chip on heat sink" design, which gives the shortest thermal path and saving on component costs
